Micro- and opto-electronic materials and structures: physics mechanics design reliability packaging is the first comprehensive reference to collect and present the most up-to-date in-depth practical and easy-to-use information on the physics mechanics reliability and packaging of micro- and opto-electronic materials assemblies structures and systems. The chapters in these two volumes contain summaries of the state-of-the-art and present new information on recently developed important methods or devices. Furthermore practical recommendations are offered on how to successfully apply current knowledge and recently developed technology to design manufacture and operate viable reliable and cost-effective electronic components or photonic devices. The emphasis is on the science and engineering of electronic and photonic packaging on physical design problems challenges and solutions. Volume i focuses on physics and mechanics of micro- and opto-electronic structures and systems i.E. On the science underpinnings of engineering methods and approaches used in microelectronics and photonics. Volume ii deals with various practical aspects of reliability and packaging of micro- and opto-electronic systems. Internationally recognized experts and world leaders in particular areas of this branch of applied science and engineering contributed to the book.
